Wafer Processing

Carbon Technology does wafers processing for customers with and without nanotubes for research, rapid prototyping and production up to tens of wafer starts per week/~a million parts per month. Some example device structures that have been previously fabricated are shown below.   

Process capabilities include: Mask/device design, lithography down to 30 nm, etch (wet & dry), metal and dielectric deposition (CVD, LPCVD, PECVD, ALD, sputter, e-beam evaporation), microscopy using SEM, Raman, AFM, TEM) and electrical/RF testing.

Structures from wafer embedded metals surviving 900C heat treatments to multiple metal layers including low k dielectric and air gap gates have been formed. Devices from simple pillars to field emission carbon nanotube FETs have been formed. Processes with highly uniform fabrication for over one million 10 GHz parts per month have been delivered.   

Please contact us at:  info@carbontekinc.com

Example Device Structures Fabricated

Do you have a carbon nanotube device structure you would like to fabricate?  We may have already built one like  it before.  A variety of options are available starting with choice of substrate material and carbon nanotube density and location/pattern.  Gate structures such as top, bottom, embedded, and gate all around can be constructed, and different dieletrics are available. Finally, contacts specially designed for carbon nanotubes finish the design.